Commission File Number 001-16125
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Advanced Semiconductor Engineering, Inc.
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( Exact name of Registrant as specified in its charter)
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26 Chin Third Road
Nantze Export Processing Zone
Kaoshiung, Taiwan
Republic of China
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(Address of principal executive offices)
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Form 20-F x Form 40-F o
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Yes o No x
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ADVANCED SEMICONDUCTOR
ENGINEERING, INC. |
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Date:
June 25, 2015
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By:
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/s/ Joseph Tung
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Name:
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Joseph Tung
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Title:
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Chief Financial Officer
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Advanced Semiconductor Engineering, Inc.
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Michelle Jao, Manager
mjao@iselabs.com
Tel: +1.510.687.2481
http://www.aseglobal.com
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Grace Teng, Manager
grace_teng@aseglobal.com
Tel: +886.2.6636.5678
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Advanced Semiconductor Engineering, Inc.
Prices Convertible Bond Offering
Taipei, Taiwan, R.O.C., June 25, 2015 — Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) (“ASE,” or the “Company”) today announced that it has priced an offering of US$200 million aggregate principal amount of its Currency Linked Zero Coupon Convertible Bonds due 2018 (the “Bonds”). The proceeds are expected to be used to fund procurement of equipment from overseas. The Bonds were offered outside the United States pursuant to Regulation S under the Securities Act of 1933, as amended (the “Act”).
Neither the Bonds nor the common shares of the Company to be delivered upon conversion of the Bonds have been or will be registered under the Act and these securities may not be offered or sold in the United States absent registration or an applicable exemption from registration requirements.
This press release does not constitute an offer to sell or the solicitation of an offer to buy any security and shall not constitute an offer, solicitation or sale in any jurisdiction in which such offering would be unlawful.
Safe Harbor Notice
This press release contains "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended, including statements regarding our future results of operations and business prospects. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2014 Annual Report on Form 20-F filed on March 18, 2015.