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CAD Design Software Introduces 4 New Electronics Packaging Designer (EPD) Suites Powered by AutoCAD OEM

EPD for Windows Suites provides a powerful platform for entire design-to-manufacturing EDA process; EPD 8.3 for AutoCAD Now Supports AutoCAD 2018-2021

EDP Standard Suite - Ceramic
EDP Standard Suite - Ceramic

The EPD Standard Suite for Windows enables the creation of prototypes by allowing designers to skip the schematic process and build their prototype directly as a board design.

SAN JOSE, Calif. - March 17, 2021 - (Newswire.com)

 CAD Design Software (CDS), a leader in Electronic Design Automation (EDA) software solutions, today announces the creation of four new Electronics Packaging Designer (EPD) suites, EPD for Windows Suites, powered by AutoCAD OEM. The AutoCAD OEM platform and graphics engine provide designers a more powerful and CAD-agnostic solution. The EPD Suites will give designers the option to have a complete printed circuit board (PCB) design solution, or just focus on specific tasks such as bond wire exporting or translation of Gerber or GDS files. CAD Design Software will also release a final 'plug-in version' of EPD for AutoCAD to support Autodesk AutoCAD software versions 2018-2021.

"We saw an increasing need from our customers to have a complete solution that included its own graphics engine and eliminating the need for a separate CAD package," said Tom Dlouhy, Technical Director at CAD Design Software. "The simplicity of working with the AutoCAD OEM platform has made a significant difference in our ability to evolve our EPD solutions to meet the needs of our customers and address the entire design and manufacturing process."

The EPD Professional Suite for Windows is the most complete solution to address the EDA design process and incorporates many tools for ease of processing thick film ceramic designs, such as an enhanced dynamic masks generator, panel generation, ODB++ output, and bondwire data export to support bondwire machines. These tools, in addition to nibbler data for removing cavity material in bulk or in steps, control of the Gerber, hole, and punch data for correct output to manufacturing, are beneficial for low and high temperature co-fired ceramic designs.

The EPD Standard Suite for Windows enables the creation of prototypes by allowing designers to skip the schematic process and build their prototype directly as a board design. This gives designers the freedom to create a layout, test it and if it works, then hand it off to a team to generate a schematic.

The EPD Basic Suite for Windows is a design solution for PCB, RF, and Flex with bi-directional Gerber translator, GDS translator, and includes schematic capture as well as 3D, advanced routing, automatic documentation, and the module of commands that allow designers to clean up the file in order to achieve the desired final result.

The EPD Starter Suite for Windows is a design solution for simple PCB designs that require only light design rule checking (DRC) with Gerber output. Schematic capture is included for electrical checking. Also included is a module of commands that allow designers to clean up the file in order to achieve the desired final result.

For designers who want to create graphic representations of a chip design only, CAD Design Software is also launching a standalone Bond Wire Exporter solution that allows designers to start with a simple DWG file that has lines, arcs, polylines, etc., representing bond wires from a chip to a substrate. The Bond Wire Exporter would then "intelligize" the DWG and the file is then output to a bond wiring machine.

"Helping partners such as CAD Design Software create powerful applications that meet the complex needs of their customers has been our focus from the beginning," said Dave Grieve, Director, OEM Partner Management at Tech Soft 3D. "AutoCAD OEM is the gold standard in OEM CAD applications, and Tech Soft 3D is proud to help our partners make the most of this powerful platform."

About CAD Design Software
CAD Design Software provides complete 2D/3D Electronic Design Automation solutions for Semiconductor packaging and PCB/RF design disciplines using specialized software programs designed in-house at CAD Design Software for applications such as Complex BGAs, Lead Frame Re-Design, Ceramic Hybrid/MCM, HTCC, LTCC, RF/Microwave, Flex and other design technologies. For more information on CAD Design Software, call 877-CAD-USER, visit our website at www.cad-design.com, or email sales@cad-design.com.

Media Contact

Angela Simoes

Partner PR Manager

angela@techsoft3d.com




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Original Source: CAD Design Software Introduces 4 New Electronics Packaging Designer (EPD) Suites Powered by AutoCAD OEM
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